Application Notes for your specific use
KERAFOL ®
High Voltage E-Heater
Simplification of the superstructure thanks to innovative hybrid ceramics
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In high-performance wide band gap semiconductors such as SiC or GaN, heat is usually dissipated via the top side of the chip. The application note shows how hybrid film and hybrid ceramics as additional material options open up new design possibilities in top-side cooling – especially where thermal performance, insulation and design variants need to be flexibly combined.
A compact overview for developers who want to expand their TIM portfolio with additional solution approaches.
Kerabsorb
EMI absorber and gap filler pad at the same time
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Electronic systems increasingly require materials that both minimize electromagnetic interference and dissipate heat efficiently. With Kerabsorb, Kerafol offers a material that combines the properties of a classic gap pad with those of an EMI absorber.
The application note shows how Kerabsorb combines reliable attenuation in the high-frequency range, high thermal conductivity and defined insulation strength in a single, easy-to-integrate material.
KERAMOLD ®
Enables thermal connection without machining the heat sink
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The efficient thermal connection of active components to a heat sink is one of the key challenges in power electronics. Thanks to injection-moulded 3D geometries, KERAMOLD ® enables a direct, form-fit connection between components and heat sinks without the need for additional processing steps on the metal.
The application note shows how KERAMOLD ® opens up new degrees of freedom for the design of thermal interfaces, reduces costs and minimizes thermal contact resistance at the same time.
Silicone-free gap fillers
Free from diisocyanates
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Diisocyanates are contained in many polyurethane products and have been subject to stricter REACH regulations since 2023. This affects some silicone-free gap fillers on the market, which are used in various electronic applications, especially when silicones cannot be used. The application note explains the relevant background and clarifies which silicone-free gap fillers are not affected by the regulations.
Stay cool under power with KERAMOLD ®
Thermally conductive TPEs for integrated thermal management
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Electronics applications increasingly require solutions that combine protection and efficient heat dissipation. KERAMOLD ® offers a new approach to this: a thermally conductive injection-moulded granulate that combines functional integration and thermal management.
The application note shows how KERAMOLD ® can be used to open up new design possibilities for modern electronic modules – from component design to system integration.
Thermal management for SiC semiconductors
Top side cooling with KERAMOLD ® as an innovative solution
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With high-performance wide band gap semiconductors such as SiC or GaN, heat is usually dissipated via the top of the chip. The application note shows how KERAMOLD ® in combination with the overmolding process can protect and cool active components precisely.
With KERAMOLD ®, thermal conduction, electrical insulation and mechanical stability can be combined in a single process step – thus opening up new degrees of freedom for the design of high-performance top side cooling solutions.
Thermal management for SiC semiconductors in the 800V range
Top side cooling with hybrid foil
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In high-performance wide band gap semiconductors such as SiC or GaN, heat is usually dissipated via the top side of the chip. The application note shows how hybrid film and hybrid ceramics as additional material options open up new design possibilities in top-side cooling – especially where thermal performance, insulation and design variants need to be flexibly combined.
A compact overview for developers who want to expand their TIM portfolio with additional solution approaches.
Thermally conductive film for TO components
Efficient heat dissipation for TO components
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TO packages such as TO-220 or TO-247 are widely used in power electronics. The application note shows how KERATHERM films optimally combine thermal conductivity and electrical insulation to enable efficient cooling and easy assembly directly on the standard packages.
Developed for different power classes, the films offer a flexible, automatable solution for modern power electronics.