Laser cutting

Below you will find an overview of the design guidelines, quality standards and test methods used in the processing of Al2O3 substrates.

In addition to our standard raw substrates, we also process ceramics with thicknesses ranging from 0.09 to 2.0 mm and maximum dimensions of 350×350 mm². CO₂ laser sources are used as standard. Laser processing is independent of the substrate forming process.

The following document provides an overview of the various laser processing options for thick-film alumina substrates. In addition, the layout can be aligned using camera systems that reference the edges of the raw material, registration marks, print marks, or similar objects.