Innovations
KERAFOL® Innovations 2026
GFL 3055
High-performance gap filler
GFL 3055 is a 2-component silicone-based gap filler “Made in Germany”, developed for high-performance electronic applications. With a high thermal conductivity of 5.5 W/mK, it ensures efficient heat dissipation and reliably protects components from overheating – even in compact designs such as top side cooling and SiC and GaN MOSFETs.
At the same time, the material offers high dielectric strength and ensures reliable insulation in highly integrated systems. Thanks to its elastic structure (Shore 00: 60-80), it reduces mechanical stresses caused by temperature changes or vibrations and thus increases the service life of the electronics.
The optimized viscosity enables easy, bubble-free application – manually or automatically – with fast cross-linking within around one hour at room temperature.
Precise, automated dispensing of the GFL 3055 on our in-house dispensing system.
Advantages of the GFL 3055 at a glance
The GFL 3055 is particularly suitable for areas with high thermal, electrical and mechanical requirements:
- > 5.5 W/mK thermal conductivity - highest thermal performance
- High electrical insulation - safe application in complex assemblies
- Shore 00 from 60-80 - flexible, vibration- and stress-reducing
- Optimum viscosity and thixotropy - easy, bubble-free application
- Good compressibility - ideal for low layer thicknesses
- Fast cross-linking at room temperature within approx. 1 hour
- Long-term protection - reliable against moisture, dust and mechanical loads
- Made in Germany - production and quality control at the highest level
Typical applications
The GFL 3055 is particularly suitable for areas with high thermal, electrical and mechanical requirements:
- Automotive power electronics, top side cooling
- AI and data centers
- Battery technology and energy converters
- Industrial controls and automation technology
Conclusion
GFL 3055 combines excellent thermal conductivity, high electrical insulation and mechanical flexibility in one material.
Downloads
For further information, please read the data sheet for the GFL 3055.
Alternatively, you can find more detailed information on our Application Notes subpage.
KP 100
Thermal Grease
The demands placed on thermal conductive materials are constantly increasing due to powerful electronics and frequent temperature changes. Conventional heat-conducting pastes and PCMs often lose performance under thermal stress (dry-out, pump-out, cracking), which increases thermal resistance and impairs cooling performance.
The newly developed KP 100 thermal paste has been specially developed for maximum reliability under thermal cycles. Thanks to its silicone-based formulation with high-performance fillers, it remains mechanically stable and retains its thermal conductivity even after thousands of temperature changes.
Its high mechanical flexibility compensates for different expansion coefficients, prevents air pockets and cracks and ensures permanently low thermal resistance. With a very low bondline thickness from 20 µm, it enables a minimal temperature difference between the component and heat sink.
KP100 - Easy Application. Powerful Performance.
Advantages for operational safety and service life
Thanks to its high cycle stability, the KP 100 significantly reduces maintenance and replacement costs. Components are cooled efficiently over the long term, which extends their service life and increases the operational reliability of the overall system.
In direct comparison to standard thermal conductive pastes, this means
- Low bond line thickness
- Permanently low thermal resistance and constant thermal conductivity
- Lower risk of thermally induced failures
- Lower total costs over the product life cycle
Typical applications
The KP 100 is the ideal solution for all applications where reliability, durability and thermal stability are crucial, e.g:
- Powerful processors and GPUs
- Power modules and semiconductor chips
- Applications with minimum gap and tolerance dimensions
Conclusion
The KP 100 thermal paste combines maximum thermal performance with exceptional cycle stability. It enables permanently stable heat transfer, protects electronic components from overheating and increases operational reliability even under extreme conditions. This makes it the first choice for anyone who relies on durable and reliable thermal conduction solutions.
Downloads
For further information, please read the data sheet for the KP 100.
Alternatively, you can find more information on our Application Notes subpage.
Polaris 3000
Gap pad
The Polaris 3000 is a specially developed gap pad for applications with extreme temperature requirements, particularly in the aerospace and defense sectors. It ensures reliable heat transfer both under cryogenic conditions and under high thermal loads and meets the highest quality and reliability standards.
The silicone-based material is elastic and at the same time compression-resistant, so that it reliably compensates for component tolerances as well as thermal expansions and contractions. As a result, thermal contact is permanently maintained even in the event of significant temperature changes. In addition to efficient heat conduction, the pad offers a high level of electrical insulation.
Thanks to its stable low-temperature behavior without embrittlement and good processability – including inherent adhesion and suitability for automated processes – the Polaris 3000 is a reliable solution for thermally demanding applications in extreme environments.
Polaris 3000 under extreme conditions: Benchmark dry ice test against conventional solutions.
Advantages of the Polaris 3000 at a glance
- Stable in extreme temperature ranges: -90 °C to +200 °C
- Shore 00 65-80: elastic and compression-resistant
- 3 W/mK Thermal conductivity with low density
- 14 kV/mm dielectric strength
- Reversible low temperature behavior without hysteresis
- Self-adhesive, optionally with adhesive layer
- Pick-and-place capability due to high film stability
Typical applications
The extraordinary properties of the pad open up new application possibilities, especially in applications with the highest demands on quality and reliability, e.g:
- Aerospace components
- Satellite and space technology
- Defense systems
- Radar and communication modules
- Temperature-critical industrial applications
Conclusion
The Polaris 3000 is designed for extreme temperatures and high loads and offers reliable heat conduction and reliable processing in demanding environments.
Downloads
For further information, please read the Polaris 3000 data sheet.
Alternatively, you can find more information on our Application Notes subpage.
GFL 2400 SL
Thin casting compound
GFL 2400 SL is a silicone-based thin potting compound for modern electronics and power electronics applications with high power density and limited installation space. It enables very thin, homogeneous and air-free layers thanks to its excellent flow and self-levelling properties – without preheating.
The material combines reliable heat dissipation with high electrical insulation and mechanical flexibility. This thermally stabilizes components, protects them from electrical influences and effectively compensates for mechanical stresses and vibrations.
Thanks to the simple mixing ratio, fast curing at room temperature and moisture-independent cross-linking, the GFL 2400 SL also offers clear process advantages and enables efficient, reproducible production processes.
GFL 2400 SL in use: Optimum flow behavior for precise and bubble-free potting.
Advantages of the GFL 2400 SL at a glance
- 2.4 W/mK Thermal conductivity - efficient heat dissipation
- Excellent self-levelling - Optimum material distribution
- 1:1 mixing ratio - simple and safe processing
- No sensitivity to moisture - stable processes and high reliability
- No preheating required - energy-efficient production process
- Fast curing (~1 h at RT) - short cycle times, high throughput
- Shore 00 30-50 - vibration and stress compensating
- 15 kV/mm dielectric strength - reliable electrical insulation
- Made in Germany - highest quality and process standards
Typical applications
The GFL 2400 SL can be used for a wide range of applications and is not limited to classic component potting or encapsulation:
- Complete circuit boards with active components (power electronics)
- Passive components (e.g. coils)
- Battery modules, especially cylindrical cells
Conclusion
The GFL 2400 SL thin potting compound combines good flow behavior, reliable heat conduction and high electrical safety with clear process-related advantages over conventional potting materials.
Downloads
For further information, please read the data sheet for the GFL 2400 SL.
Alternatively, you can find more detailed information on our Application Notes subpage.
GFL 3035 ultracold
Gap Filler
GFL 3035 ultracold is a silicone-based 2-component gap filler for applications with extreme temperature requirements, particularly in aerospace and defense. It remains permanently elastic even at very low temperatures and does not become brittle, ensuring a stable thermal bond even in the event of severe temperature changes.
In addition to efficient heat dissipation, the material offers high electrical insulation and reduces mechanical stresses caused by vibrations or expansion. Thanks to easy processing, fast curing and very good adaptation to complex geometries, GFL 3035 ultracold is ideal for thermally and mechanically demanding applications in extreme environments.
Advantages of the GFL 3035 ultracold at a glance
- 2K silicone-based gap filler
- Suitable for extreme temperature ranges
- Permanently elastic and compression-resistant
- Efficient heat dissipation for complex geometries
- High electrical insulation
- 1:1 mixing ratio - easy processing
- No preheating required
- Fast curing at room temperature
- Ideal for mil-standard applications
Typical applications
The GFL 3035 ultracold opens up new application possibilities wherever the highest demands are placed on reliability and temperature stability, including in:
- Aerospace components
- Satellite and space technology
- Defense and security systems
- Radar and communication modules
- Temperature-critical industrial applications
Conclusion
GFL 3035 ultracold is designed for extreme temperatures and high loads. As a liquid gap filler, reliable processing is possible for demanding applications.
Downloads
For further information, please read the data sheet for the GFL 3035 ultracold.
Alternatively, you can find more detailed information on our Application Notes subpage.