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Overmoulding of electronic components with thermally conductive granulate

Auf der Electro-Plast 2026 in Brüssel gibt Wolfgang Höfer, Business Unit Leader bei KERAFOL®, spannende Einblicke in aktuelle Entwicklungen wärmeleitfähiger Materialien.
In seinem Vortrag „Overmoulding of electronic components with thermally conductive granulate“ am 21. April 2026 um 11:20 Uhr zeigt er innovative Ansätze für das Umspritzen elektronischer Komponenten mit thermisch leitfähigen Granulaten. Der Beitrag ist Teil der Session Developments in conductive materials.

At Electro-Plast 2026 in Brussels, Wolfgang Höfer, Business Unit Leader at KERAFOL®, will present insights into the latest developments in thermally conductive materials.
His presentation „Overmoulding of electronic components with thermally conductive granulate“ taking place on April 21, 2026 at 11:20 a.m., highlights innovative approaches to overmoulding electronic components using thermally conductive granulates. The talk is part of the session Developments in conductive materials.

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