1.0Kerafolhttps://www.kerafol.com/en/CP-2https://www.kerafol.com/en/author/cp2-admin/rich600338<blockquote class="wp-embedded-content" data-secret="UPueP3k3Pr"><a href="https://www.kerafol.com/en/thermal-management/gap-pads/">Gap pads</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://www.kerafol.com/en/thermal-management/gap-pads/embed/#?secret=UPueP3k3Pr" width="600" height="338" title="“Gap pads” — Kerafol" data-secret="UPueP3k3Pr" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://www.kerafol.com/wp-includes/js/wp-embed.min.js </script> Gap pads (Softtherm®) The constantly increasing technical demands on electrical and electronic assemblies lead to major challenges in the area of thermal management. Due to the miniaturization of components and the higher performance of devices, component temperatures would increase significantly without countermeasures, which can lead to the failure of the entire assembly. In order to […]