Thermal Compounds can well be used for encapsulating whole applications and for dispensing housing lids or heat sinks. Thanks to its easy usage, it allows even the most complicated geometries to be encapsulated.
Benefits
outstanding adaptability and compressibility
low mechanical tension
high thermal conductivity
long term stability
compatible with industrial production sequences
Applications
RD-RAM modules
memory chips
chipsets
micro BGA
heat pipe applications
high voltage electronic components
KERATHERM® Thermal Compounds
GFL 3020 / GFL 3025 / GFL 3030 / GFL 3040 – silicone elastomers Ceramic-filled, solvent-free two-component silicone elastomers. Due to their various thermal conductivities, their different compressibility characteristics as well as their good dielectric properties, these Gapfillers are ideally suitable for encapsualting or dispensing. A wide range of different material viscosities makes them suitable for “wet-in-wet” production.
KERATHERM® Thermal Compounds
The GFL 1800 SL is a solvent free Gap Filler Liquid based on a 2K silicone elastomer with a thermal conductivity of 1.8 W/mK, a dielectric breakdown of 15 kV/mm and a viscosity of < 7000 mPas. In comparison to other Gap Filler Liquids the viscosity is 1/10. Therefore the material, “flowing like water”, has the advantage of self-levelling and filling up every corner like a common potting material.
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