Kerafol® offers special sensor substrates for thin- and thickfilm applications.
Thinfilm technology Thinfilm layers ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Electronic semiconductor devices, special sensors are the main applications for thin-film technology. The average thickness of circuits is 1 µm. The circuits are mainly done for thin film substrates are coated by a PVD process. Therefore, high demands with respect to the surface and grainsstructure of the ceramic substrate are made. The ceramic powder for the particular sensor substrate material must therefore have a particle size of about 1 micron.
Thickfilm Technology Thick film is used to produce electronic devices such as sensors, hybrid integrated circuits and surface mount devices based on LTCC or HTCC technology. The conductivity paths for thick film application are applied by screen printing on substrates or tapes.
Keraprotec is a specific partially stabilised zirconia oxide substrate for thinfilm applications. This substrate material combines good electrical insulating properties (at room temperature) with a high bending strength and high fracture toughness. Due to the very fi ne grains and evenness of the Keraprotec very fine Pt-structures are possible.
We lasercut the material according to your wishes! Please send in your CAD data.
Advantages
Applications
very fine-grained homogeneous grain structure
good electrical insulation properties at room temperature
3YSZ is a special partially stabilized zirconia which is for thin film applications. Among others, it can also be used as an ion conductive ceramic membrane for Solid Oxide Fuell Cells (SOFC). This material is characterized by its excellent flexibility, extremely high bending strength and high fracture toughness. Another advantage is that this material can be manufactured in extremly thin thicknesses.
The standard substrate thickness is 0.15 mm, the minimal thickness just 40 µm. Other dimension are possible. Please send in your inquiry.
We lasercut the material according to your wishes! Please send in your CAD data.
Advantages
Applications
very fine-grained homogeneous grain structure of 1 µm
good electric insulation properties at room temperature
extremely good mechanical strength
can be cut by laser or wafer saw
good evenness
standard thickness of 0.15 mm with high flexibility
This zirconia thoughened alumina substrate material shows very good results after laser scribing and breaking, or even when cut with a waver saw. ATS is especially for thinfilm applications. ATS can be easily cutted or structured by laser or waver saw. Due to its inner mechanical strength and fine grains the material has much less material chipping at the processing edges during manufacturing process compared to other materials. Due to the very fine grains of the ATS very fine Pt-structures are possible.
We lasercut the material according to your wishes! Please send in your CAD data.
Advantages
Main Applications
very fine-grained homogeneous grain structure < 1 µm
good electrical insulation properties
high mechanical strength
processing by laser or waversaw possible, very low on chipping
Keral 99 is a high alumina substrate material with 99.7% purity. Due to the high degree of purity and the fine grain structure, it has a very high thermal conductivity up to 30 W / mK. The dielectric strength is the highest of Kerafol´s ceramic substrate materials.
We lasercut the material according to your wishes! Please send in your CAD data.
Keral 96 is a substrate material for thickfilm coating applications. This material has good electrical properties and a good thermal conductivity. Other ingredients are mainly NaO2 and SiO2. It is a less cost alternative thickfilm substrate material compared to Keral 99.
We lasercut the material according to your wishes! Please send in your CAD data.
Advantages
Applications
inexpensive substrate material
good electrical insulation capability
good mechanical strength
good thermal conductivity
cutable by laser or waver saw
good evenness
alumina substrate material for thickfilm technology
