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      • KERATHERM® Gap Filler Liquids
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Thin- and thickfilm substrates

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Thin- and thickfilm substrates

Kerafol® offers special sensor substrates for thin- and thickfilm applications.

Thinfilm technology
Thinfilm layers ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Electronic semiconductor devices, special sensors are the main applications for thin-film technology. The average thickness of circuits is 1 µm.
The circuits are mainly done for thin film substrates are coated by a PVD process.
Therefore, high demands with respect to the surface and grainsstructure of the ceramic substrate are made. The ceramic powder for the particular sensor substrate material must therefore have a particle size of about 1 micron.

Thickfilm Technology
Thick film is used to produce electronic devices such as sensors, hybrid integrated circuits and surface mount devices based on LTCC or HTCC technology.
The conductivity paths for thick film application are applied by screen printing on substrates or tapes.

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KERAFOL® Substrates

Keraprotec
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3YSZ
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ATS
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Keral 99
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Keral 96
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Keral 99 TF

Keraprotec
partially stabilised zirconia

Keraprotec is a specific partially stabilised zirconia oxide substrate for thinfilm applications. This substrate material combines good electrical insulating properties (at room temperature) with a high bending strength and high fracture toughness. Due to the very fi ne grains and evenness of the Keraprotec very fine Pt-structures are possible.

We lasercut the material according to your wishes! Please send in your CAD data.


AdvantagesApplications
  • very fine-grained homogeneous grain structure
  • good electrical insulation properties at room temperature
  • very good mechanical strength
  • can be cut by laser or waver saw
  • good planarity
  • sensor substrates
  • sensor protection plate
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Data sheet - KERAPROTEC

3YSZ-Sensor
3mol % Yttria stabilized zirconia

3YSZ is a special partially stabilized zirconia which is for thin film applications. Among others, it can also be used as an ion conductive ceramic membrane for Solid Oxide Fuell Cells (SOFC). This material is characterized by its excellent flexibility, extremely high bending strength and high fracture toughness. Another advantage is that this material can be manufactured in extremly thin thicknesses.

The standard substrate thickness is 0.15 mm, the minimal thickness just 40 µm. Other dimension are possible. Please send in your inquiry.

We lasercut the material according to your wishes! Please send in your CAD data.


AdvantagesApplications
  • very fine-grained homogeneous grain structure of 1 µm
  • good electric insulation properties at room temperature
  • extremely good mechanical strength
  • can be cut by laser or wafer saw
  • good evenness
  • standard thickness of 0.15 mm with high flexibility
  • producible with a minimal thickness of 40 µm
  • sensor substrate for thin film application
  • sensor protection plate
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Data sheet - 3YSZ sensor

ATS
Alumina thin film substrates

This zirconia thoughened alumina substrate material shows very good results after laser scribing and breaking, or even when cut with a waver saw. ATS is especially for thinfilm applications. ATS can be easily cutted or structured by laser or waver saw. Due to its inner mechanical strength and fine grains the material has much less material chipping at the processing edges during manufacturing process compared to other materials. Due to the very fine grains of the ATS very fine Pt-structures are possible.

We lasercut the material according to your wishes! Please send in your CAD data.


AdvantagesMain Applications
  • very fine-grained homogeneous grain structure < 1 µm
  • good electrical insulation properties
  • high mechanical strength
  • processing by laser or waversaw possible, very low on chipping
  • very good evenness
  • outstanding performance for thinfilm applications
  • thinfilm application, e.g. temperature sensors
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Data sheet - ATS

Keral 99
Alumina 99,7 %

Keral 99 is a high alumina substrate material with 99.7% purity. Due to the high degree of purity and the fine grain structure, it has a very high thermal conductivity up to 30 W / mK. The dielectric strength is the highest of Kerafol´s ceramic substrate materials. 

We lasercut the material according to your wishes! Please send in your CAD data.


AdvantagesApplications
  • fine-grained homogeneous grain structure
  • very good electrical insulating ability
  • good mechanical strength
  • very good thermal conductivity
  • cuttable with laser or waver saw
  • good evenness
  • thickfilm substrate material
  • sensor protection plate
  • electrical insulator
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Data sheet - Keral 99

Keral 96
Alumina 96 %

Keral 96 is a substrate material for thickfilm coating applications. This material has good electrical properties and a good thermal conductivity. Other ingredients are mainly NaO2 and SiO2. It is a less cost alternative thickfilm substrate material compared to Keral 99.

We lasercut the material according to your wishes! Please send in your CAD data.


AdvantagesApplications
  • inexpensive substrate material
  • good electrical insulation capability
  • good mechanical strength
  • good thermal conductivity
  • cutable by laser or waver saw
  • good evenness
  • alumina substrate material for thickfilm technology
  • sensor protection plate
  • electrical insulator
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Data sheet - Keral 96

Keral 99 TF

This alumina substrate can shine with very smooth surfaces in the true sense of the word due to its fine-grained structure of <2µm particles. Our Keral 99 TF is primarily designed for thin film applications and can be easily cut or patterned by laser or wafer saw. The deposition of platinum is easily implemented using standard thin film technology. Thanks to the advantageous flatness of <200µm (4"x4"), fine will be accurately imaged. The substrates are "Made in Germany" here in Eschenbach in der Oberpfalz.

We cut the material according to your requirements using laser equipment. Please send us your CAD data.


AdvantagesApplications
  • Very fine-grained, homogeneous structure < 2 µm
  • Good electrical insulation properties
  • High mechanical strength 500 MPa
  • Can be processed with laser or wafer saw
  • Excellent price/performance ratio
  • Nice smooth surfaces with ra<90nm on A-side for fine structured conducting paths
  • thin film application e.g. temperature sensors
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Data sheet - Keral 99 TF

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Do you have any questions, requests or suggestions? How can we help you?

Dipl.-Ing. (FH) Michael Rott
Department manager ceramic tapes & substrates
+49 (0)9645 88 481
+49 (0)9645 88 492
cts@kerafol.com

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92676 Eschenbach i.d.OPf.
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