Ceramic-filled, two-component silicone elastomers. Because of their various thermal conductivities and differing compressibility behavior, their good dielectric properties, and being free of solvents, these materials are ideally suitable for encapsulating or dispensing. The wide range of different material viscosities available makes them of interest for "wet-in-wet" production.

Customer-specific solutions for the compound technology and processing technology are our strength .

• RD-RAM module
• chipsets
• heat pipe thermal solutions
• memory chips
• micro BGA 
• high voltage electronic components

For further information please see our Datasheets.