KERAFOL Keramische Folien GmbH | Wednesday, 8. September 2010

Druckversion der Seite: Innovation in Thermal management

URL: www.kerafol.com/en/innovation-in-thermal-management.html

The continuously increasing technical demands placed by the electronics industry on electronic and electrical devices has led to a dramatic rise in the problem of heat generation.

Higher frequencies, component miniaturization, enhanced functionality and increased device power ratings all lead to high temperatures that need to be controlled to ensure very good performance, stability and durability over the long term. Heat sinks, cooling plates and ventilators are often used to dissipate the heat and reduce the temperature of the electrical circuits to a minimum.

The thermal coupling of suitable heat-conducting materials is also gaining importance in this area. KERAFOL with “KERATHERM^®” products, offers an effective, uncomplicated and cost-effective range of products for this purpose.
 

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